High-density design
Printed circuit board design adapted to semiconductor package forms with advancing narrow pitch.
We propose the optimal printed circuit board design and manufacturing based on the packages used.
- Company:ピーダブルビー 草津事業所
- Price:Other
1~2 item / All 2 items
Printed circuit board design adapted to semiconductor package forms with advancing narrow pitch.
We propose the optimal printed circuit board design and manufacturing based on the packages used.
Achieving miniaturization, high density, and high reliability with flex-rigid integration!
Our company generates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs that prevent prototyping" and "the desire to ensure high reliability." Flex-rigid substrates contribute to miniaturization and high-density design without connectors, reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction for molds through router processing ■ Multi-layer structure possible for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.